This is an exciting position with the Module Development Team in Canesta, reporting to the Director of Module Engineering. The team develops reference design camera modules meeting large OEM customer specifications for our highly integrated and high performance breakthrough 3D Time of Flight image sensor chips and camera technology. The position involves developing and bringing up prototype systems using early silicon, collaborating with the chip and firmware development teams to finalize designs, iterating to stable validated reference designs and deploying and supporting those reference designs as contract manufacturers and customers adopt them and convert them into high volume products.
Job Responsibilities:
- Develop electrical designs for application-specific 3D Time of Flight (TOF) cameras
- Troubleshoot electrical designs to meet functional and performance goals
- Specify requirements for board and module diagnostics and other ‘whole product’ deliverables to satisfy needs of a manufacturing partner
- Finalize electrical designs to prepare for deployment to customers; meet EMI, ESD, etc. standards and industry certifications such as USB, MIPI, etc.
- Manage outside vendors/consultants to fabricate, assemble & test PCBs
- Support camera module assembly, bring up and debug
- Evaluate design tradeoffs, their impact to the final product, and incorporate them successfully
- Drive the handoff of completed product designs to Contract Manufacturers
Minimum Job Requirements:
- Bachelor’s degree in Electrical Engineering or equivalent, with at least 5 years relevant hands-on engineering experience with board-level mixed signal system design.
- Working knowledge of FPGA development tools, firmware development tools for troubleshooting complex board designs
- Design experience with high speed, high power/current driver circuits
- Detailed knowledge of lab. troubleshooting instruments, PCB design & assembly norms, advanced PCB design and verification methods
- Experience deploying designs to contract manufacturers for productization and volume ramp
- Must have strong communication skills, good organization and skilled in writing quality engineering documentation.
- Appetite and proven track record in fast paced, challenging hands-on engineering, do what it takes in a team context to deliver a successful product
Additional Preferred Skills:
- Masters degree in EE preferred
- CMOS image sensor-based prototype or product development
- Strong firmware development and embedded system debug background
- Experience interfacing with Mechanical Engineering, Optical Engineering in design, assembly & test of prototypes and products
- Light source driver design using LEDs or LASERs.
- Successful launch into production of 1 to 2 consumer products through offshore CMs
