A hands-on engineering position within the Manufacturing Operations team, reporting to the Director of Operations. The team manages process development, qualification and release to manufacturing for our highly integrated and high performance breakthrough 3D Time of Flight image sensor chips and camera technology. The ideal candidate will be a strongly motivated hands-on engineer who is willing to learn the details of operation of Canesta's technology and manage the manufacturing and yield/quality enhancement efforts within the organization.
Job Responsibilities
- Work with Development Engineering on design and manufacturability of next generation pixel technology
- Work with Test Engineering to develop a comprehensive test plan, and manage the implementation of the test programs to execute to that plan
- Product characterization of both pixel function and device logic circuitry
- Management of product qualification and ramp to volume production
- Management of yields, yield analysis and associated yield enhancement efforts in all operational areas (fab, sort, assembly, test)
Minimum Requirements
- BSEE or equivalent.
- 5 years experience in IC mixed signal testing, characterization and qualification of new silicon products.
- Experience with image sensor manufacturing and testing
- Strong background in all aspects of device manufacturing (wafer fab through finished goods)
- Must have strong communication and planning skills and be willing to travel to support offshore vendors.
- Familiarity with experimental design (D.O.E.), data analysis tools and statistics
Additional Preferred Skills
- Experience with Agilent 93K test platform and Teradyne IP750
- Strong background in quality, reliability, and failure analysis
- Experience with ISO requirements and implementation
- Program management experience, and working familiarity with project tracking software (Microsoft Project or similar)
- Language skills in Mandarin
